Global Hermetic Packaging Market is to be Driven by the Need to Protect Highly Sensitive Electronic Components

Hermetic Packaging
  • Hermetic Packaging Market

TheHermetic Packaging Marketwas valued at USD 3.76 Billion in 2021 and is projected to reach USD 5.12 Billion by 2028, growing at a Compound Annual Growth Rate (CAGR) of 4.5 % within the forecast period of 2022-2028. The Global Hermetic Packaging Market has seen strong growth due to the increasing use of hermetic packaging of electronics and the growing consumer electronics industry. The widespread use of hermetic applications in defense, aerospace, and military and commercial applications increases the need for hermetic packaging in various regions.

It will be largely driven by middle-class economists. Growth can be attributed to fast-growing e-commerce activities in the emerging economy and improving air connectivity in small towns. Although a major obstacle to the development of hermetic implants is microelectronic components used in the military, aerospace, and medical equipment which need to meet strict hermetic packaging regulations primarily due to their harsh environments and critical applications. Strengthening standards companies to purchase new leaky testing tools as old items do not have the sensitivity required to be tested in accordance with new standards. Hermetic packaging suppliers need to adhere to such standards in order to maximize their market share at increasing cost. These strong levels of hermetic implants are expected to slow down market growth. Another factor that is expected to hinder the growth of the Hermetic Packaging Market is the presence of alternative packaging methods. One of these methods is the installation of Plastic. Especially in the military and defense, where extreme weather is a major challenge facing parts, hermetic packing comes out inadequate as a protective locking mechanism. Plastic packaging becomes a place due to its tolerant capacity in terms of external conditions.

The Hermetic Packaging Market is divided on the basis of configuration such as multi-ceramic packages, compressed ceramic packages, and metal can packages. On a general type basis, the market is divided into passivation glass, reed glass, transponder glass, stainless steel glass (GTMS), and ceramic-metal sealing (CERTM). Based on the application, the market is divided into transistors, sensors, lasers, airbags, photodiodes, crystals, MEMS switches and more. While on an industry basis, the market is divided into military and defense, aeronautics and space, automotive, nuclear and nuclear security, medical, communications, consumer electronics, and more.

The Asia Pacific is the fastest growing Hermetic Packaging Market worldwide, dominated by China, Japan, South Korea, India, and Taiwan. Increased energy demand, the emerging economy, and rising defense costs are some of the factors driving the growth of this market in the region. The growing power of emerging economic powers such as China, India, and South Korea increases the need for hermetic packaging for key electronic components. Increased energy demand based on high GDP growth rates in developing countries creates opportunities for well-packaged parts in the Asia Pacific. North America, Europe, and the rest of the world cover the remaining geographic market.

Some of the key players in the Hermetic Packaging Market are Texas Instruments Incorporated (US), Amkor Technology, Inc. (US), AMETEK, Inc. (US), SCHOTT (Germany), Kyocera Corporation (Japan), Materion Corporation (US), Egide (France), Micross Components Inc. (US), Teledyne Technologies (US), and Legacy Technologies Inc. (US).